MCP1827/MCP1827S

DS22001C-page 26

5-Lead Plastic Transistor Outline (AT) [TO-220]

Notes:

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

5

Pitch

e

.067 BSC

Overall Pin Pitch

e1

.268 BSC

Overall Height

A

.140

–

.190

Overall Width

E

.380

–

.420

Overall Length

D

.560

–

.650

Molded Package Length

D1

.330

–

.355

Tab Length

H1

.204

–

.293

Tab Thickness

A1

.020

–

.055

Mounting Hole Center

Q

.100

–

.120

Mounting Hole Diameter

φP

.139

–

.156

Lead Length

L

.482

–

.590

Base to Bottom of Lead

A2

.080

–

.115

Lead Thickness

c

.012

–

.025

Lead Width

b

.015

.027

.040

E

Q

D

D1

H1

A

A1

A2

c

N

e

e1

b

1 2 3

L

CHAMFER

OPTIONAL

P

φ

Microchip Technology Drawing C04-036B