MCP1603-ADJISLASHOS datasheet(4/26 Pages) MICROCHIP

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MCP1603

DS22042A-page 4

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

VIN - GND.......................................................................+6.0V

All Other I/O ...............................(GND - 0.3V) to (VIN + 0.3V)

LX to GND .............................................. -0.3V to (VIN + 0.3V)

Output Short Circuit Current..................................Continuous

Power Dissipation (Note 5) ..........................Internally Limited

Storage Temperature.....................................-65°C to +150°C

Ambient Temp. with Power Applied.................-40°C to +85°C

Operating Junction Temperature...................-40°C to +125°C

ESD Protection On All Pins:

HBM..............................................................................4 kV

MM...............................................................................300V

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational sections of this specification is not intended.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC CHARACTERISTICS

Electrical Characteristics: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V,

IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Characteristics

Input Voltage

VIN

2.7

—

5.5

Note 1

Maximum Output Current

IOUT

500

——

Note 1

Shutdown Current

IIN_SHDN

—

0.1

µA

SHDN = GND

Quiescent Current

—45

µA

SHDN = VIN, IOUT = 0 mA

Shutdown/UVLO/Thermal Shutdown Characteristics

SHDN, Logic Input Voltage Low

VIL

——

%VIN VIN = 2.7V to 5.5V

SHDN, Logic Input Voltage High

VIH

——

%VIN VIN = 2.7V to 5.5V

SHDN, Input Leakage Current

IL_SHDN

-1.0

±0.1

1.0

µA

VIN = 2.7V to 5.5V

Undervoltage Lockout

UVLO

2.12

2.28

2.43

VVIN Falling

Undervoltage Lockout Hysteresis UVLOHYS

—

140

—

Thermal Shutdown

TSHD

—

150

—

°C

Note 4, Note 5

Thermal Shutdown Hysteresis

TSHD-HYS

—10

—

°C

Note 4, Note 5

Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

3: VR is the output voltage setting.

4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum

allowable power dissipation causes the device to initiate thermal shutdown.

5: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits

must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.

6: The current limit threshold is a cycle-by-cycle peak current limit.

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