AD8597ACPZ-R2 datasheet(17/20 Pages) AD

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Data Sheet

AD8597/AD8599

Rev. F | Page 17 of 20

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 60. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body (R-8)

Dimensions shown in millimeters and (inches)

0.30

0.25

0.20

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50

BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED-4

TOP VIEW

BOTTOM VIEW

SIDE VIEW

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 61. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

AD8597ACPZ-R2

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

A22

AD8597ACPZ-REEL

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

A22

AD8597ACPZ-REEL7

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

A22

AD8597ARZ

−40°C to +125°C