2000 Jul 03

19

Philips Semiconductors

Product specification

10-bit high-speed low-power ADC

TDA8764A

PACKAGE OUTLINES

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

10.4

10.0

5.4

5.2

0.65

1.25

7.9

7.6

0.9

0.7

1.1

0.7

8

0

o

o

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT341-1

MO-150

95-02-04

99-12-27

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

114

28

15

0.25

y

pin 1 index

0

2.5

5 mm

scale

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

SOT341-1

A

max.

2.0