ADA4700-1ARDZ-R7 datasheet(8/28 Pages) AD

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ADA4700-1

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

110 V

Input Voltage

V− ≤ VIN ≤ V+

Input Current

±10 mA

Differential Input Voltage

V− ≤ VIN ≤ V+

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range1

−40°C to +85°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

ESD

Charged Device Model (CDM)

1250 V

Human Body Model (HBM)

4500 V

Machine Model (MM)

200 V

Refer to the Thermal Management section.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. The

values in Table 5 were obtained per JEDEC standard JESD51.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead SOIC_N_EP

°C/W

Board layout impacts thermal characteristics such as θJA. When

proper thermal management techniques are used, a better θJA

can be achieved. Refer to the Thermal Management section for

additional information.

Although the exposed pad can be left floating, it must be

connected to an external V− plane for proper thermal

management.

ESD CAUTION

Rev. 0 | Page 8 of 28

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