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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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M58LT128HST 데이터시트(PDF) 70 Page - STMicroelectronics |
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M58LT128HST 데이터시트(HTML) 70 Page - STMicroelectronics |
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70 / 110 page  Package mechanical M58LT128HST, M58LT128HSB 70/110 13 Package mechanical In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 18. TBGA64 10 × 13 mm - 8 × 8 active ball array, 1 mm pitch, bottom view package outline 1. Drawing is not to scale. E1 E D1 D eb SD SE A2 A1 A BGA-Z23 ddd FD FE BALL "A1" |
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