LE A P1MR

DATASHEET

DATASHEET

10 | Version 1.1 | 2022-08-17

Dimensional Drawing 7)

Further Information:

Approximate Weight:

5,000.0 mg

ESD advice:

The device is protected by ESD device which is connected in parallel to the

Chip.

Notes:

For superior solder joint connectivity results we recommend soldering under

standard nitrogen atmosphere.

Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

Connector:

TYU, TU1502 Series, 1.50mm Pitch, Wire to Board Wafer,

Part Number TU1502WNR-10S-*-*

Recommended mating

connector:

TYU, TU1502 Series, 1.50mm Pitch, Wire to Board Housing,

Part Number TU1502HNO-10

TYU, TU1502 Series, 1.50mm Pitch, Terminal,

Part Number TU1502TPO-*