ADA4062-2/ADA4062-4

Rev. B | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 3.

Parameter

Rating

Supply Voltage

±18 V

Input Voltage

±VSY

Differential Input Voltage

±VSY

Input Current

±10 mA

Output Short-Circuit Duration to GND

Indefinite

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. It was

measured using a standard 4-layer board.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead SOIC

120

45

°C/W

8-Lead MSOP

142

45

°C/W

10-Lead LFCSP

132

46

°C/W

14-Lead TSSOP

112

35

°C/W

16-Lead LFCSP

75

12

°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

POWER SEQUENCING

The supply voltages of the op amps must be established

simultaneously with, or before, any input signals are applied. If

this is not possible, the input current must be limited to 10 mA.

ESD CAUTION