Data Sheet

ADA4859-3

Rev. A | Page 15 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

2.25

2.10 SQ

1.95

16

5

13

8

9

12

1

4

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

(BOTTOM VIEW)

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

0.25 MIN

0.75

0.60

0.50

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 39.16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad (CP-16-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering Quantity

ADA4859-3ACPZ-R2

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

250

ADA4859-3ACPZ-R7

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

1,500

ADA4859-3ACPZ-RL

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

5,000

ADA4859-3ACP-EBZ

Evaluation Board

1 Z = RoHS Compliant Part.