ADA4622-2BRZ-R7 datasheet(10/36 Pages) AD

10 / 36 page

Data Sheet

ADA4622-1/ADA4622-2/ADA4622-4

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. F | 10 of 36

Table 4.

Parameter

Rating

Supply Voltage

36 V

Input Voltage

(V−) −0.3 V to (V+) +0.2 V

Differential Input Voltage

36 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature, Soldering (10 sec)

300°C

ESD Rating, Human Body Model (HBM)

4 kV

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to PCB

thermal design is required.

Table 5. Thermal Resistance

Package Type1, 2

θJA

θJC3

Unit

8-Lead SOIC_N

1-Layer JEDEC Board

N/A

°C/W

2-Layer JEDEC Board

120

N/A

°C/W

8-Lead MSOP

1-Layer JEDEC Board

N/A

115

°C/W

2-Layer JEDEC Board

185

N/A

°C/W

8-Lead LFCSP

1-Layer JEDEC Board

N/A

°C/W

2-Layer JEDEC Board

145

N/A

°C/W

2-Layer JEDEC Board with 2 × 2 Vias

N/A

°C/W

5-Lead SOT-23

1-Layer JEDEC Board

N/A

°C/W

2-Layer JEDEC Board

339

N/A

°C/W

14-Lead SOIC_N

1-Layer JEDEC Board

N/A

°C/W

2-Layer JEDEC Board

N/A

°C/W

16-Lead, 4 × 4 mm LFCSP

1-Layer JEDEC Board

N/A

2.2

°C/W

2-Layer JEDEC Board

N/A

°C/W

1 Thermal impedance simulated values are based on a JEDEC thermal test

board. See JEDEC JESD51.

2 N/A means not applicable.

3 For θJC test, 100 μm thermal interface material (TIM) is used. TIM is assumed

to have 3.6 W/mK.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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