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PM3386 데이터시트(PDF) 49 Page - PMC-Sierra, Inc

부품명 PM3386
상세설명  DUAL GIGABIT ETHERNET CONTROLLER
PDF  315 Pages
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제조업체  PMC [PMC-Sierra, Inc]
홈페이지  http://www.pmc-sierra.com
Logo PMC - PMC-Sierra, Inc

PM3386 데이터시트(HTML) 49 Page - PMC-Sierra, Inc

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RELEASED
PM3386
DATASHEET
PMC-1991129
ISSUE 7
DUAL GIGABIT ETHERNET CONTROLLER
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
42
Notes on Pin Description:
1. All PM3386 inputs and bi-directional signals present minimum capacitive
loading and operate at TTL logic levels except the inputs marked as Analog
or PECL.
2. The GTX_CLK0, GTX_CLK1, TXD0[7:0], TXD1[7:0], TX_ER0, TX_ER1,
TX_EN0, TX_EN1, MDC, MDIO, STPA, PTPA, DTPA[1:0], RVAL,
RDATA[31:0], RPRTY, RMOD[1:0], RSOP, REOP, RERR, RSX, PAUSED0,
PAUSED1, D[15:0], INTB, and TDO outputs have 6mA drive capability.
3. All digital inputs are 5V tolerant.
4. The PECL inputs and outputs should be terminated in a passive network and
interface at PECL levels as described in the Operations section.
5. It is mandatory that every ground pin (VSS) be connected to the printed
circuit board ground plane to ensure reliable device operation.
6. It is mandatory that every digital power pin (VDDI, VDDO, and VDDQ) be
connected to the printed circuit board power planes to ensure reliable device
operation.
7. All analog power pins can be sensitive to noise. They must be isolated from
the digital power. Care must be taken to correctly decouple these pins.
8. It is mandatory that every analog power pin (AVDL, AVDH, and AVDQ) be
de-coupled from but connected to the printed circuit board power planes to
ensure reliable device operation.
8. Due to ESD protection structures in the pads it is necessary to exercise
caution when powering a device up or down. ESD protection devices behave
as diodes between power supply pins and from I/O pins to power supply pins.
Under extreme conditions it is possible to damage these ESD protection
devices or trigger latch up. Please adhere to the recommended power supply
sequencing as described in the Operation section of this document.



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