EMC1412 datasheet(39/46 Pages) MICROCHIP

부품명	EMC1412

상세설명	Multiple Channel 1°C Temperature Sensor with Beta Compensation

PDF	46 Pages

Scroll/Zoom	100%

제조업체	MICROCHIP [Microchip Technology]

홈페이지	http://www.microchip.com

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39 / 46 page

 2014-2022 Microchip Technology Inc. and its subsidiaries

DS20005273B-page 39

EMC1412

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.70

1.50

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.69

0.28

Microchip Technology Drawing C04-2382A

NOM

8-Lead Very Thin Plastic Dual Flat, No Lead Package (8Q) - 2x3 mm Body [VDFN]

SILK SCREEN

Contact Pad Spacing

2.84

Space Between Pads

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

Contact Pad to Center Pad (X8)

(G2)

0.225 REF

(G2)

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