SAM9X75 SiP

Mechanical Characteristics

Data Sheet

© 2023 Microchip Technology Inc. and its subsidiaries

DS60001827B - 27

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.80 BSC

MIN

E

MAX

12.80 BSC

Contact Pad Width (X243)

X

0.35

NOM

C1

Contact Pad Spacing

12.80 BSC

Contact Pad to Contact Pad

G

0.45

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2022 Microchip Technology Inc.

Microchip Technology Drawing C04-23556 Rev B

C1

C2

E

ØX

G

SILK SCREEN

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

1 2345 6789 10 11 12 13 14 15 16 17

243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA]