data sheet

CBGA

Features:

CERAMIC

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Ceramic Ball Grid Array

Package (CBGA)

Amkor's CBGAs incorporate the most advanced

assembly processes and designs for today and

tomorrow's cost/performance applications. This

advanced IC package technology allows

application and design engineers to optimize

innovations while maximizing the performance

characteristics of semiconductors (Si & GaAs).

Amkor's CBGAs are designed for low inductance,

improved thermal operation and enhanced

SMT-ability. Custom performance enhancements,

such as ground and power planes, are available

for significant improvements in electrical response

demanded by advancing electronics. Additionally,

these CBGAs utilize industry proven, semiconductor

grade materials for reliable, long-term operation

while providing the user flexible design parame-

ters. The CBGA is a ceramic substrate package. It

consist of a ceramic substrate which is covered

with a B-Staged epoxy lid or by encapsulating it.

Applications:

Semiconductor technologies find enhanced

performance by using the integrated design

features of Amkor's CBGAs. Microprocessors/con-

trollers, ASICs, Gate Arrays, memory, DSPs and PC

chip sets find Amkor's CBGA family to be an ideal

package. Applications requiring improved

portability, form-factor/size and high-performance

such as cellular, wireless, PCMCIA cards, laptop

PC's, video cameras, disc drives, power amplifiers

and other similar products benefit from Amkor's

CBGA attributes.

The CBGA offers a variety of features. From

innovative designs and expanding package

offerings, Amkor provides a platform from

prototype-to-production.

•

Flexible ball counts

•

10mm to 35mm body sizes

•

1.0, 1.27, 1.5mm ball pitch available

•

Eutectic (63/37) solder balls

•

Perimeter, stagger and full ball arrays

•

Special packaging for memory available

•

≤ 6 mil coplanarity

•

Multi-layer, ground/power

•

Cavity lid seal or encapsulation

•

Full in-house design capability

•

JEDEC MO-151 standard outlines

•

High thermal conductive ceramic

DS800

Rev Date: 08’02

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