data sheet

CDIP / CerDIP

Features:

CERAMIC

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Ceramic Dual-Inline Package

(CDIP / CerDIP)

Amkor Technology is committed to continuing to

service this long established standard industry

package. The Amkor Technology CDIP capability

provides a wide range of lead counts and body

sizes. The CDIP is a hermetic package consisting of

two pieces of dry pressed ceramic surrounding a

"DIP formed" leadframe. The ceramic / LF /

ceramic system is held together hermetically by

frit glass reflowed at temperatures between

400° - 460° Centigrade.

Applications:

Along with the other standard industry packages,

the CDIP has a proven track record and is still

being used by semiconductor technologies such as:

Digital to Analog converters, EPROMS, Air bag

sensors, Logic, Memory, Microcontrollers, and

Video controllers. Some end applications are:

Military electronics, Commercial electronics,

Automotive and Telecommunications.

The CDIP offers a variety of features:

•

300 mil package body width with lead counts

from 8L to 28L

•

400 mil package body width with lead counts

of 22L & 24L

•

600 mil package body width with lead counts

from 24L to 40L

•

100 mil lead pitch

•

High thermal conductive ceramic

•

Matte Tin lead finish

•

JEDEC standard compliant

•

Wide selection of available cavity sizes to meet

most die size needs

•

Commercial or full Military flows

DS801

Rev Date: 08’02

.