data sheet

CMCM

Features:

CERAMIC

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Ceramic Multi-Chip Module

Package (CMCM)

The MCM/CBGA and MCM/PBGA by Amkor

Technology incorporates the latest technology in

high-density Ceramic and Plastic IC packaging.

The high-speed performance and thermal

advantages of the CBGA and PBGA package

provide the platform for increased enhancement

for mixed semiconductor technologies such as:

Analog/Digital, bipolar/CMOS, ASIC, DSP, etc. in a

single IC package.

Applications:

This MCM technology allows existing and

presently available ICs to be designed in a single,

space-saving, low-cost system package.

MCM-CBGAs and MCM-PBGAs provide the features

required by laptops, portables, sub-notebooks,

telecomm, wireless, PC cards and other

applications.

The MCM-CBGA offer a variety of features:

•

Improved thermal performance

•

Superior electrical performance

•

Controlled impedance

•

Very low design and tooling cost

•

Electroless Au (gold) plating process

•

Standard and custom ball counts available

•

Eutectic solder balls

•

Flexible circuit designs

•

Advanced in-house design capability

•

Versatile substrate routing

•

Choice of package body sizes

DS804

Rev Date: 08’02

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