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Configuration Options

ePad TSSOP, ePad MSOP, ePad SOIC and ePad SSOP Nominal Package Dimensions (mm)

Package

Type

Lead

Count

Body

Width

Body

Length

Body

Thickness

Standoff

Overall

Height

Lead

Pitch

Tip-to-Tip

JEDEC

ExposedPad

TSSOP

8

4.4

3.0

0.90

0.10

1.00

0.65

6.4

MO-153

14

4.4

5.0

0.90

0.10

1.00

0.65

6.4

MO-153

16

4.4

5.0

0.90

0.10

1.00

0.65

6.4

MO-153

20

4.4

6.5

0.90

0.10

1.00

0.65

6.4

MO-153

28

4.4

9.7

0.90

0.10

1.00

0.65

6.4

MO-153

38

4.4

9.7

0.90

0.10

1.00

0.50

6.4

MO-153

ExposedPad

MSOP

8

3.0

3.0

0.85

0.10

0.95

0.65

5.0

MO-187

10

3.0

3.0

0.85

0.10

0.95

0.50

5.0

MO-187

ExposedPad

SOIC

8

3.9

4.9

1.47

0.05

1.52

1.27

6.00

MO-012

16

3.9

9.9

1.47

0.05

1.52

1.27

6.0

MO-012

ExposedPad

SSOP

36

7.6

10.3

2.28

0.05

2.45

0.50

10.40

MO-271

ePad TSSOP/MSOP/SOIC/SSOP