Thermal Performance

Thermal Performance vs. Cost

Applications

The integrated design features of Amkor’s PBGAs

offer enhanced performance in many devices,

making this the ideal package for: microprocessors,

microcontrollers, ASICs, gate arrays, memory, DSPs,

PLDs, graphics and PC chip sets.

Applications requiring improved portability,

form-factor/size and high-performance such as cellular,

wireless telecommunications, PCMCIA cards, Global

Positioning Systems (GPS), laptop PCs, netbooks, video

cameras, disc drives and similar products benefit from

Amkor’s PBGA attributes.

Reliability Qualification

Amkor assures reliable performance by continuously

monitoring key indices.

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Moisture sensitivity characterization: JEDEC level 3,

30°C/60% RH, 192 hours

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uHAST: 130°C/85% RH, 96 hours

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Temp cycle: -55°C/+125°C, 1000 cycles

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High temp storage: 150°C, 1000 hours

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Automotive AEC-Q100 reliability available

Process Highlights

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Die thickness: 13 mils

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Bond pad pitch (min): 2.4 mils

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Au wire diameter: 1.2-0.5 mils

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Cu wire diameter: 1.2-0.7 mils

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Marking: Laser

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Ball inspection: Optical

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Pack/Ship options: JEDEC trays, dry pack

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Wafer backgrinding available

Standard Materials

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Package substrate: CCL-HL832HX-A

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Die attach adhesive: Ablestik 2300

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Wire: Au HTS/Cu PCC

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Mold compound: Nitto GE100L, Sumitomo G770FE

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Solder balls: Leaded or lead-free options

Test Services

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Program generation/conversion

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Product engineering

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Wafer sort

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256 pin x 20 MHz test system available

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-55°C to +125°C test available

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Burn-in capabilities

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Tape and reel services

Shipping

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JEDEC outline CO-029 low-profile tray

Cross Section PBGA

2

3

4

5

*Max powers shown are estimates based on 35 x 35 mm body, 10.2 x 10.2 mm die, 64 thermal balls/vias, ∆T = 50°C, no air flow, JEDEC multilayer PCB

Relative Cost

TEPBGA-3

Θ

JA = 11

Max Power = 4.5W

TEPBGA-2

Θ

JA = 11.8

Max Power = 4.2W

TEPBGA-1

Θ

JA = 15.8

Max Power = 3.2W

PBGA

Θ

JA = 17.5

Max Power = 2.8W

A

Mold compound

Eutectic solder ball

Via

Die attach adhesive

A

B

C

D

Die

Wirebond

Rigid laminate

Solder mask

E

F

G

H

B

C

D

E

F

G

H