TLE2141, TLE2141A, TLE2141Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIERS

SLOS062D – NOVEMBER 1990 – REVISED AUGUST 1994

5–3

POST OFFICE BOX 655303

symbol

+

–

OUT

IN +

IN –

OFFSET N1

OFFSET N2

TLE2141Y chip information

This chip, when properly assembled, displays characteristics similar to the TLE2141. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

OUT

IN +

IN –

VCC+

(7)

(3)

(2)

(6)

(4)

VCC –

(1)

(5)

OFFSET N1

OFFSET N2

65

64

(7)

(6)

(5)

(4)

(3)

(2)

(1)