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whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not

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reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are

registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2021 Amkor Technology, Incorporated. All Rights Reserved. DS360R-EN Rev Date: 12/21

Visit amkor.com or email sales@amkor.com for more information.

Shipping

f

Clear anti‑static tube, 20 inch

f

Tape and reel

f

Dry pack

f

Drop ship

SSOP/QSOP

Cross Section SSOP/QSOP

Configuration Options

SSOP/QSOP Nominal Package Dimensions (Inches – Unless Otherwise Specified)

Package

Type

Lead

Count

Body

Width

Body

Length

Body

Thickness

Standoff

Overall

Height

Lead

Pitch

Tip-to-Tip

JEDEC

Factory

Package

Outline

Drawing #

SSOP

14/16

5.3 mm

(209 mil)

6.2 mm

1.73 mm

0.13 mm

1.86 mm

0.65 mm

7.80 mm

MO‑150

P1

32289

20

5.3 mm

(209 mil)

7.2 mm

1.73 mm

0.13 mm

1.86 mm

0.65 mm

7.80 mm

MO‑150

P1

32289

24

5.3 mm

(209 mil)

8.2 mm

1.73 mm

0.13 mm

1.86 mm

0.65 mm

7.80 mm

MO‑150

P1

32289

28

5.3 mm

(209 mil)

10.2 mm

1.73 mm

0.13 mm

1.86 mm

0.65 mm

7.80 mm

MO‑150

P1

32289

QSOP

16

0.150

0.194

0.058

0.006

0.064

0.0250

0.236

MO‑137

P1

32864

Services And Support

Amkor has a broad base of resources available to help

customers bring quality products to market quickly and

at the lowest possible cost.

f

Full package characterization

f

Thermal, mechanical stress and electrical

performance modeling

f

Turnkey assembly, test and drop ship

f

World‑class reliability testing and failure analysis

Test Services

f

Program generation/conversion

f

Wafer probe

f

Burn‑in capabilities

f

‑55°C to +165°C test available

f

Strip test available

Wirebond

Die attach adhesive

Mold compound

A

B

Die attach pad

Cu leadframe

C

D

E

C

A

B

E

D