21

MARCH 1994 - REVISED MARCH 2000

TISP7125F3, TISP7150F3, TISP7180F3, TISP7240F3, TISP7260F3,

TISP7290F3, TISP7320F3, TISP7350F3, TISP7380F3

TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

P R O D UCT

INFORM A T ION

MECHANICAL DATA

D008

plastic small-outline package

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

5,21 (0.205)

4,60 (0.181)

NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0,15 (0.006).

D. Lead tips to be planar within ±0,051 (0.002).

1,75 (0.069)

1,35 (0.053)

6,20 (0.244)

5,80 (0.228)

5,00 (0.197)

4,80 (0.189)

D008

8

765

4

3

2

1

4,00 (0.157)

3,81 (0.150)

7° NOM

3 Places

7° NOM

4 Places

0,51 (0.020)

0,36 (0.014)

8 Places

Pin Spacing

1,27 (0.050)

(see Note A)

6 Places

1,12 (0.044)

0,51 (0.020)

4° ± 4°

0,79 (0.031)

0,28 (0.011)

0,203 (0.008)

0,102 (0.004)

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

8-pin Small Outline Microelectronic Standard

Package MS-012, JEDEC Publication 95

0,50 (0.020)

0,25 (0.010)

x45°NOM

0,229 (0.0090)

0,190 (0.0075)

MDXXAAC

INDEX