ADL5904

Data Sheet

Rev. B | Page 8 of 27

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage, VPOS

5.5 V

Input Average RF Power1

25 dBm

Equivalent Voltage, Sine Wave Input

5.62 V peak

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

1

Driven from a 50 Ω source. Input ac-coupled with an external 82.5 Ω shunt

resistor.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

θJA1

θJC2

Unit

CP-16-22

80.05

4.4

°C/W

1

Thermal impedance simulated value is based on no airflow with the exposed pad

soldered to a 4-layer JEDEC board.

1

Thermal impedance from junction to exposed pad on underside of package.

ESD CAUTION