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STM32G473MB 데이터시트(PDF) 218 Page - STMicroelectronics |
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STM32G473MB 데이터시트(HTML) 218 Page - STMicroelectronics |
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218 / 229 page ![]() Package information STM32G473xB STM32G473xC STM32G473xE 218/229 DS12712 Rev 5 6.10 UFBGA121 package information (B0CU) This UFBGA is a 121 balls, 6 x 6 mm, 0.5 mm pitch, fine pitch, square ball grid array package. Figure 71. UFBGA121 - Outline 1. Drawing is not to scale. 2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. A4 A2 A1 A C SEATING PLANE E1 e E F F A D1 D e 12 34 56 789 10 11 A B C D E F G H J K L A1 INDEX CORNER AREA b (121 BALLS) eee C A B fff C BOTTOM VIEW SIDE VIEW B0CU_UFBGA121_ME_V1 |
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