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STM32G473MB 데이터시트(PDF) 222 Page - STMicroelectronics

부품명 STM32G473MB
상세설명  Arm® Cortex®-M4 32-bit MCUFPU, up to 512 KB Flash, 170 MHz / 213 DMIPS, 128 KB SRAM, rich analog, math accelerator
PDF  229 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G473MB 데이터시트(HTML) 222 Page - STMicroelectronics

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Package information
STM32G473xB STM32G473xC STM32G473xE
222/229
DS12712 Rev 5
6.11.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
ΘJC
Thermal resistance junction-case
LQFP128 - 14 × 14 mm
7.0
°C/W
Thermal resistance junction-case
LQFP100 - 14 × 14 mm
8.3
Thermal resistance junction-case
LQFP80 - 12 × 12 mm
8.2
Thermal resistance junction-case
LQFP64 - 10 × 10 mm
8.0
Thermal resistance junction-case
LQFP48 - 7 × 7 mm
9.6
Thermal resistance junction-case
TFBGA100 - 8 × 8 mm
13
Thermal resistance junction-board
UFBGA121 - 6 × 6 mm
TBD
Thermal resistance junction-case
UFQFPN48 - 7 × 7 mm
2(1)
7.5
Thermal resistance junction-case
WLCSP81 - 4.02 X 4.27 mm
1.46
ΘJB
Thermal resistance junction-board
LQFP128 - 14 × 14 mm
19.9
°C/W
Thermal resistance junction-board
LQFP100 - 14 × 14 mm
22.9
Thermal resistance junction-board
LQFP80 - 12 × 12 mm
22.3
Thermal resistance junction-board
LQFP64 - 10 × 10 mm
21.8
Thermal resistance junction-board
LQFP48 - 7 × 7 mm
24.3
Thermal resistance junction-board
TFBGA100 - 8 × 8 mm
13.42
Thermal resistance junction-board
UFBGA121 - 6 × 6 mm
TBD
Thermal resistance junction-board
UFQFPN48 - 7 × 7 mm
11
Thermal resistance junction-board
WLCSP81 - 4.02 X 4.27 mm
27.45
1. Thermal resistance junction-case where the case is the bottom thermal pad on the UFQFPN package.
Table 118. Package thermal characteristics (continued)
Symbol
Parameter
Value
Unit



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