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TSL13 데이터시트(PDF) 12 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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TSL13 데이터시트(HTML) 12 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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12 / 14 page ![]() TSL12T, TSL13T LIGHT-TO-VOLTAGE CONVERTERS TAOS062D − APRIL 2007 12 r r Copyright E 2007, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MANUFACTURING INFORMATION The reflow profile specified here describes expected maximum heat exposure of devices during the solder reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be limited to one pass through the solder reflow profile. Table 1. TSL12T, TSL13T Solder Reflow Profile PARAMETER REFERENCE TSL12T, TSL13T Average temperature gradient in preheating 2.5°C/sec Soak time tsoak 2 to 3 minutes Time above T1, 217°C t1 Max 60 sec Time above T2, 230°C t2 Max 50 sec Time above T3, (Tpeak −10°C) t3 Max 10 sec Peak temperature in reflow Tpeak 260° C (−0°C/+5°C) Temperature gradient in cooling Max −5°C/sec t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 18. TSL12T, TSL13T Solder Reflow Profile |
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