TSL2562, TSL2563

LOW-VOLTAGE

LIGHT-TO-DIGITAL CONVERTER

TAOS066J − MAY 2007

30

r

r

Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MECHANICAL DATA

PACKAGE CS

Six-Lead Chipscale Device

171

1398

465

203

1250

6

400 + 50

700 + 55

TYP 305

500

500

375 + 30

500

375 + 30

1750

TOP VIEW

SIDE VIEW

BOTTOM VIEW

END VIEW

6

1

2

3

6

5

4

PIN OUT

BOTTOM VIEW

Lead Free

Pb

NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.

B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).

C. The top of the photodiode active area is 410 μm below the top surface of the package.

D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.

E. This drawing is subject to change without notice.

Figure 19. Package CS — Six-Lead Chipscale Packaging Configuration