2

Soldering and Mounting Considerations

It is recommended to use manual soldering for HCTL-

2021/2017 launch pad devices due to the characteristics

of the material used in the launch pad design that not

allow wave soldering.

Direct mounting on printed circuit board (PCB) only is

recommended for HCTL-2021/2017 launch pad devices.

Mounting gap of 1mm between the base of the launch

pad and customer’s printed circuit board (PCB) is

required.

NOTE: Precaution is required in order to avoid bend or loose pin

during product handling.

Length (L)

Width (W)

Thickness (T)

HCTL-2017

22.86 ± 0.5 mm

12.70 ± 0.5 mm

1.67 ± 0.25 mm

HCTL-2021

27.94 ± 0.5 mm

12.70 ± 0.5 mm

1.67 ± 0.25 mm

D0

CLK

SEL

OE

RST

CH B

CH A

VSS

VDD

D1

D2

D3

D4

D5

D6

D7

1

2

3

4

5

6

7

89

10

11

12

13

14

15

16

PINOUT A

VDD

D1

D2

D3

CNTdec

CNTcas

D4

D5

D6

D7

D0

CLK

SEL

OE

U/D

NC

RST

CH B

CH A

VSS

14

15

13

12

11

16

5

17

18

19

6

7

8

9

10

4

2

3

20

1

PINOUT B

(dimension in mm)

HCTL-2021 SHOWN

PIN DRAWING

Package Dimensions with Tolerances