MIC5233

DS20006033E-page 4

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Enable Input Current

IEN

–1.0

0.01

1.0

µA

VEN = 0.6V; regulator off

—

0.1

1.0

VEN = 2.0V; regulator on

—

0.5

2.5

VEN = 36V; regulator on

Start-up Time

tSTART

—

1.7

7

ms

VIN applied before EN signal

TEMPERATURE SPECIFICATIONS(1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature Range

TJ

-40

—

+125

°C

—

Storage Temperature Range

TS

-65

—

+150

°C

—

Package Thermal Resistances

Thermal Resistance 5-Lead SOT23

JA

—

235

—

°C/W

—

Thermal Resistance 3-Lead SOT223

JA

—

50

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: Design guidance only, not production tested.

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: TJ = +25°C with VIN = VOUT + 1V; IOUT = 100 µA; Bold values indicate -40°C ≤ TJ ≤ +125°C,

unless otherwise specified. Specifications for packaged product only.

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: Design guidance only, not production tested.