Pad Coordinates

Pad No.

X

Y

Pad No.

X

Y

1

-1070.900

-1459.100

13

-328.550

-2039.750

2

-1070.900

-1554.100

14

-109.963

-2052.049

3

-1070.900

-1657.100

15

-19.960

-2052.049

4

-1070.900

-1752.100

16

70.043

-2052.049

5

-1070.900

-1855.100

17

794.300

-2045.900

6

-1070.900

-1950.100

18

889.300

-2045.900

7

-1070.900

-2053.100

19

1044.974

-2089.750

8

-869.350

-2045.900

20

1062.200

-1994.724

9

-766.350

-2045.900

21

1048.625

-1899.700

10

-671.350

-2045.900

22

1035.400

-1792.026

11

-568.350

-2045.900

23

1035.400

-1661.176

12

-473.350

-2045.900

24

1035.400

-1450.676

Pad Description

Pad Name

I/O

Option

Description

PA0~PA7

I/O

Wake-up,

Pull-high

or None

Bidirectional 8-bit I/O port. Each pin can be configured as a wake-up input by

configuration option. Software instructions determine the CMOS output or

Schmitt trigger input with or without pull-high resistor (configuration option).

PB0~PB3

I/O

Pull-high

or None

Bidirectional 4-bit I/O port. Software instructions determine the CMOS output or

Schmitt trigger input (pull-high resistor depending on configuration option).

VSS

¾¾

Negative power supply, ground

VDD

¾¾

Positive power supply

VSSP

¾¾

PWM negative power supply, ground

VDDP

¾¾

PWM positive power supply

RES

I

¾

Schmitt trigger reset input, active low

OSC1,

OSC2

¾

RC or

Crystal

OSC1 and OSC2 are connected to an RC network or crystal (by configuration

option) for the internal system clock. In the case of RC operation, OSC2 is the

output terminal for 1/4 system clock. The system clock may came form the crys-

tal, the two pins cannot be floating.

PWM1,

PWM2

O

¾

PWM output for driving a external transistor or speaker.

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-20°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT83R074

Rev. 1.00

4

May 17, 2007