DIE Information

RHFL4913 ADJUSTABLE VERSION

10/16

6.1

Die bonding pad locations and electrical functions.

Die physical dimensions.

Die size: 150mils x 110mils (3.81mm by 2.79mm)

Die thickness: 375µm

± 25µm (14.8 mils ± 1 mil)

Control pads: 184µm x 184µm (7.25mils square)

Interface materials.

Top metallization: Al/Si/Cu, 1.05µm

± 0.15µm

Backside metallization: None

Glassivation.

Type: P. Vapox + Nitride

Thickness: 0.6µm

± 0.1µm + 0.6µm ± 0.08µm

Substrate: bare Silicon

Assembly related information.

Substrate potential: Floating recommended to be tied to Ground

Special assembly instructions: "Sense" pad not used, not internally connected to any

part of the IC. Can be connected to Ground when space anti-static electricity rules

apply.