Package information

STA240

4/6

3

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

LBGA 288 mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

Ref.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.700

0.0669

A1

0.270

0.0106

A2

1.085

0.0427

A3

0.300

0.0118

A4

0.800

0.0315

b

0.450

0.500

0.550 0.0177 0.0197 0.0217

D

18.800 19.000 19.200 0.7402 0.7480 0.7559

D1

17.000

0.6693

e

1.000

0.0394

E

18.800 19.000 19.200 0.7402 0.7480 0.7559

E1

17.000

0.6693

F

1.000

0.0394

ddd

0.200

0.0079

eee

0.250

0.0098

fff

0.100

0.0039

LBGA288 (19x19x1.70)

Low Profile Ball Grid Array

7131786 C

Bottom view