King Billion Electronics Co., Ltd.

駿

億

電

子

股

份

有

限

公

司

HE89C21

HE80000 SERIES

January 20, 2003

16

V1.0E

18. Application Circuit

VDD

VDD

PRTC5

PRTC4

FXI

PRTC3

FXO

PRTC2

RESET

PRTC1

PRTC0

LV3

SEG31

LV2

SEG30

LV1

SEG29

LC2

SEG28

LC1

SEG27

COM0

SEG26

COM1

SEG25

COM2

SEG24

COM3

SEG23

SEG0

SEG22

SEG1

SEG21

SEG2

0

51K

+

47uF

104

0.1uF

0.1uF

0.1uF

3.0V

0.1uF

0.47uF

22p

22p

3579545Hz

C11

33p

C12

33p

Y3

32768Hz

HE89C21

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

PRTC5

PRTC4

PRTC3

PRTC2

PRTC1

PRTC0

SEG31

SEG30

SEG29

SEG28

SEG27

SEG26

SEG25

SEG24

SEG23

SEG22

SEG21

SEG2

SEG1

SEG0

COM3

COM2

COM1

COM0

LC1

LC2

LV1

LV2

LV3

GND

RSTP

FXO

FXI

TSTP

19. Important Note

1. Please bond the TSTP_P, RSTP_N and PRTD[7:0] with test points on PCB, which can be soldered

and probed, and connect TSTP_P pin with zero ohm resistor to GND (or copper wire which can be cut

easily on PCB) for good ESD protection. So that IC testing can be done on PCB, if necessary by

removing the 0-ohm resistor and driving TSTP_P pin to high.LV3 must small than 9.0 Volt. Otherwise

IC may breakdown.

20. Updated Record

Version

Date

Section

Original Content

New Content