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CPC1908J 데이터시트(PDF) 1 Page - Clare, Inc. |
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CPC1908J 데이터시트(HTML) 1 Page - Clare, Inc. |
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1 / 6 page ![]() www.clare.com DS-CPC1908-R05 1 CPC1908 i4-PAC™ Power Relay e3 RoHS 2002/95/EC Part Number Description CPC1908J i4-PAC Package (25 per tube) Parameter Rating Units Blocking Voltage 60 V P Load Current, T A=25ºC With 5°C/W Heat Sink 8.5 A rms No Heat Sink 3.5 On-Resistance 0.3 Ω RθJC 0.35 °C/W Applications Features Description Ordering Information Pin Configuration Switching Characteristics of Normally Open (Form A) Devices CONTROL I LOAD 10% 90% TON TOFF + + Approvals • UL recognized component: File # E69938 • Certified to: UL 508 • Compact i4-PAC™ Power Package • Low Thermal Resistance (0.35 °C/W) • 8.5A rms Load Current with 5°C/W Heat Sink • Electrically Non-conductive Thermal Pad for Heat Sink Applications • Low Drive Power Requirements • Arc-Free With No Snubbing Circuits • 2500V rms Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Industrial Controls • Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1908 single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 8.5A rms continuous load current with a 5°C/W heat sink. The CPC1908 employs optically coupled MOSFET technology to provide 2500V rms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique i4-PAC package pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500V rms isolation but also very low thermal resistance (0.35 °C/W). |
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