TLC2801Z, TLC2801Y

Advanced LinCMOS

™ LOW-NOISE PRECISION

OPERATIONAL AMPLIFIERS

SLOS116B – JULY 1982 – REVISED SEPTEMBER 1996

3–2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

VIOmax

PACKAGED DEVICES

CHIP

TA

VIOmax

AT 150

°C

SMALL OUTLINE

(D)

PLASTIC DIP

(P)

FORM

(Y)

–40

°C to 150°C

1.5 mV

TLC2801ZD

TLC2801ZP

TLC2801Y

The D packages are available taped and reeled. Add R suffix to the device type when ordering

(e.g., TLC2801ZDR).

TLC2801Y chip information

This chip, properly assembled, displays characteristics similar to the TLC2801. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax= 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

OUT

IN +

IN –

VCC+

(7)

(3)

(2)

(6)

(4)

VCC – / GND

(2)

(3)

(4)

(6)

(7)

80

90