CMOS High Voltage Logic – CD4541B

Rev 1.0

11/06/20

Programmable Timer in bare die form

Description

Features:



Available outputs 2

8, 210, 213 or 216

The CD4541B programmable timer consists of a 16-stage

binary counter, integrated oscillator for use with an

external capacitor and x2 resistors, an automatic power-on

reset circuit and output control logic. Power-on triggers

automatic reset circuitry to initialize all counters. With

power already on, an external reset pulse can be applied.

Upon release of the initial reset command, the oscillator

will oscillate with a frequency determined by the external

RC network. The 16−stage counter divides the oscillator

frequency (fosc) with the nth stage frequency being fosc/2

n.

Counter increments on positive clock edge.



Built-in low-power RC oscillator

≈ DC to 100kHz



External clock option (Pad 3) overrides oscillator



Use as 2

n frequency divider or single transition timer



Q/Q select provides output logic level flexibility



Auto or master reset disables oscillator for lower PD



CD4K process benefits: Wide supply voltage range;

Symmetrical outputs; Low IQ; High noise immunity

 Direct drop-in replacement for obsolete components in

long term programs.

Die Dimensions in µm (mils)

Ordering Information

Die Size (Unsawn)

1300 x 1430

51 x 56

µm

mils

Minimum Bond Pad Size

85 x 85

3.35 x 3.35

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

The following part suffixes apply:



1300 (51)

No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (400 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

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