TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

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Issue 1.0.5

2018-01-25

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com

The Embedded I/O Company

TA308 with TMPE633-12R & Platform Cable USB

TA309

Technical Information

 Form Factor: Full-Mini Card

 Board size: 50.95 mm x 30 mm

 PCI Express 1.1 compliant interface

 Xilinx XC6SLX25T-2 Spartan-6 User programmable

FPGA

 PCIe endpoint in FPGA

 64 Mbit SPI-EEPROM for FPGA configuration and

User Data

 Digital I/O

 26 ESD-protected 5 V-tolerant TTL lines with

programmable pull resistor (-10R)

 13 differential RS-485 lines (-11R)

 13 differential M-LVDS lines (-12R)

 Direction individually programmable

 I/O access

 30 pin Pico-Clasp latching connector

 Operating temperature -40°C to +85°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C)

TMPE633: 980.000 h