CF1156 series

SEIKO NPC CORPORATION —2

PAD LAYOUT and COORDINATES

(Unit:

µm)

PAD DESCRIPTION

Chip size: 1.23

× 1.23mm

Chip thickness: 300 ± 30µm

T1, T2, TC, and TO bonding is not required.

VDD

(0,0)

(1230,1230)

1

2

3

4

5

6

78

9

10

11

LO

BO

TC

T2

T1

VSS TO OSH

LH

VSS

Number

Pad

Pad dimensions (Unit:

µm)

XY

1

BO

930

1075

2

LO

529

1075

3

VDD

155

1075

4

TC

155

887

5

T2

155

608

6

T1

155

420

7

VSS

223

155

8

TO

486

155

9

OSH

750

155

10

LH

1041

155

11

VSS

1075

420

Name

Function

OSH, LH

Melody mode control inputs. Built-in pull-down resistors mean LOW-level signals are obtained when inputs are open circuit. The

resistance of the pull-down resistor varies with the applied voltage, as described in the Electrical Characteristics.

LO

LED drive output, HIGH level during non-play mode.

BO

Piezoelectric speaker driver output. LOW level output during non-play mode and during musical rest notes. HIGH level output

during gaps between melody notes.

VDD

VSS

Ground

T1, T2, TC

Test inputs. Pull-down resistor built-in.

TO

Test output. The oscillator frequency (typ. 50kHz) is output for monitoring purposes.