CF5037 series

SEIKO NPC CORPORATION —2

PAD LAYOUT

(Unit:

µm)

PIN DESCRIPTION and PAD DIMENSIONS

Chip size: 1.10

× 1.30mm

Chip thickness: 300 ± 30µm

PAD size: 150µm

× 100µm (VCC, OUT, OUTN pins)

100µm

× 100µm (excluding VCC, OUT, OUTN pins)

Chip base: GND potential

Note: The TEST pin is not used during normal operation.

Pad No.

Name

I/O

Function

Pad dimensions [µm]

XY

1

VCC

–

(+) supply pin

160

130

2

XIN

I

Oscillator input pin

511

130

3

XOUT

O

Oscillator output pin

740

130

4

GND

–

(–) ground pin

965

130

5OE

I

Output enable pin. Outputs are high impedance when LOW (oscillator

stopped). Power-saving pull-up resistor built-in.

896

1170

6

VCC2

–

(+) output buffer supply pin

756

1170

7

OUTN

O

Output pin (complementary)

523

1170

8

OUT

O

Output pin (true)

244

1170

9

TEST

I

IC test pin. Leave open circuit for normal operation.

136

678

(0,0)

(1100,1300)

X

Y

DB5037

1

VCC

TEST

GND

XIN XOUT

23

4

5

6

7

OUT OUTN

8

9

VCC2 OE