Feedback resistor placing

It is important to place the resistor divider close to the FB pin to reduce noise sensitivity of the output voltage

feedback path. Route the VOUT sense path away from noisy nodes and preferably through a layer on the other

side of a shielded layer.

Thermal aspects

The device power dissipation inside the IC is mainly due to the DC-DC integrated MOSFET power loss. The heat

generated due to this power dissipation level requires a suitable heat sink to keep the junction temperature below

the overtemperature protection threshold (Thermal Shutdown) at the rated ambient temperature. Try, where

possible, to increase the number of power planes connected to improve the heat dissipation.

However, different layouts are also possible. Basic principles suggest keeping the IC in the middle of the

dissipating area; to provide as many vias as possible; to design a dissipating area having a shape as square as

possible and not interrupted by other copper traces.

DCP3601

Application information

DS14782 - Rev 1

page 14/26