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Axelite Confidential Materials, do not copy or distribute without written consent.

Rev.1.1 Nov.01, 2019

AX3703A



ORDER/MARKING INFORMATION

Order Information

Top Marking (SOT-23-5L)

Package Type

AX3703A

Packing

A : Taping

X X X

B: SOT-23-5L

Blank : Bag

C: SOT-23-6L

Z8: TDFN-8L (2X2)

H

WW: 01~26(A~Z)

27~52(a~z)

ID code: internal

AX3703A

D Y W X

Year: 8=2018

9=2019

B=2020

C=2021

D=2022

:

Z=2044

Top Marking (SOT-23-6L)

Top Marking (TDFN-8L)

H

AX3703A

WW:01~26 (A~Z)

27~52 (a~z)

ID code:internal

E Y WX

Year: 8=2018

9=2019

B=2020

C=2021

D=2022

:

Z=2044

Week: 01~26(A~Z)

27~52(a~z)

ID Code: Internal

Y W X

G E

AX3703A

Year: 8=2018

9=2019

B=2020

C=2021

D=2022

:

Z=2044



ABSOLUTE MAXIMUM RATINGS

VIN ….…..

…….. -0.3V to +6.5V

VSW …………..….....

… -0.3V to VIN +0.3V

Dynamic VSW in 10ns Duration -2V to VIN +2V

The other Pins ………… ….... -0.3V to +6.5V

Junction Temperature Range

… -40°C to +150°C

Storage Temperature Range . . -65°C to +150°C

Lead Temperature( Soldering 10s) … …. … 260°C

ESD …………………………………...

….. Class 2

Recommend Operating Conditions (Note2)

Input Voltage (VBAT) ………… ..… +2.5V to 5.5V

Output Voltage (VOUT) ……… … … +0.6V to VIN

Operating Temperature Range ..….. . -40°C to +85°C

Thermal information (Note3, 4)

Maximum Power Dissipation(TA=25°C )

SOT235(6) ............................................. 0.48W

Thermal Resistance(θJA) SOT235(6) ….. …. 210°C/W

Thermal Resistance(θJC) SOT235(6) ….... …. 32°C/W

DFN2x2_8L .............................................. 2.1W

Thermal Resistance(θJA) DFN2x2_8L ….. …. 46°C/W

Thermal Resistance(θJC) DFN2x2_8L ……. .. 10°C/W

Note (1): Stress exceeding those listed “Absolute Maximum Ratings” may damage the device.

Note (2): The device is not guaranteed to function outside of the recommended operating conditions.

Note (3): Measured on JESD51-7, 4-Layer PCB.

Note (4): The maximum allowable power dissipation is a function of the maximum junction temperature

TJ_MAX, the junction to ambient thermal resistance θJA, and the ambient temperature TA. The maximum

allowable continuous power dissipation at any ambient temperature is calculated by PD_MAX= (TJ_MAX-TA)/θJA.

Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from

permanent damage.