MCP2557FD datasheet(21/36 Pages) MICROCHIP

21 / 36 page

 2016 Microchip Technology Inc.

DS20005533A-page 21

MCP2557FD/8FD

4.0

PACKAGING INFORMATION

4.1

Package Marking Information

Example:

8-Lead DFN (03x03x0.9 mm)

Part Number

Code

MCP2557FDT-H/MF

DAEO

MCP2557FD-H/MF

DAEO

MCP2558FDT-H/MF

DAEQ

MCP2558FD-H/MF

DAEQ

DAEN

1609

256

Example:

8-Lead SOIC (150 mil)

MCP2557

1609

256

Part Number

Code

MCP2557FDT-H/SN

MCP2557

MCP2557FD-H/SN

MCP2557

MCP2558FDT-H/SN

MCP2558

MCP2558FD-H/SN

MCP2558

Legend:

XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC®designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC® designator ( )

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will be

carried over to the next line, thus limiting the number of available characters for

customer-specific information.

Example:

8-Lead TDFN (02x03x0.8 mm)

Part Number

Code

MCP2557FDT-H/MNY

ACZ

MCP2558FDT-H/MNY

ADA

ACZ

609

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