ADSP-BF522C/ADSP-BF525C/ADSP-BF527C

Preliminary Technical Data

Rev. PrB

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Page 11 of 12

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June 2007

OUTLINE DIMENSIONS

Dimensions in the outline dimension figures are shown in

millimeters.

SURFACE MOUNT DESIGN

Table 6 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351,

Generic Requirements for Surface Mount Design and Land Pat-

tern Standard.

Figure 6.

289-Ball Chip Scale Package Ball Grid Array (Mini-BGA)

NOTES

1. DIMENSIONS ARE IN MILLIMETERS.

2. COMPLIES WITH JEDEC REGISTERED OUTLINE

MO-195, VARIATION AJ AND EXCEPTION TO PACKAGE HEIGHT

AND BALL HEIGHT.

3. MINIMUM BALL HEIGHT 0.20

CL

CL

0.5 BSC

BALL

PITCH

11.00 BSC SQ

TOP VIEW

A1 BALL

PAD CORNER

12.00 BSC SQ

SIDE VIEW

DETAIL A

DETAIL A

SEATING PLANE

0.35

0.30

0.25

BALL DIAMETER

0.08

MAX

COPLANARITY

0.20 MIN

BOTTOM VIEW

A1 BALL

PAD CORNER

M

B

C

D

E

F

G

H

J

K

L

N

R

T

A

3

4

5

6

7

8

9

10

11

12

13

14

15

16

1

2

289-BALL MINI BGA

(BC-289-2)

1.40

1.26

1.11

17

18

19

20

21

22

23

U

V

W

Y

AA

AB

AC

P

Table 6. BGA Data for Use with Surface Mount Design

Package

Ball Attach Type

Solder Mask Opening

Ball Pad Size

289-Ball Chip Scale Package Ball Grid Array (Mini-BGA)

Solder Mask Defined

0.26 mm diameter

0.35 mm diameter