STV7622

Tested wafer disclaimer

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Tested wafer disclaimer

All wafers are tested and guaranteed to comply with this specification until the wafer sawing

stage, for a period of ninety (90) days from the delivery date.

Please remember that it is the customer’s responsibility to test and qualify their application

using the STMicroelectronics die. STMicroelectronics is ready to support customers when

qualifying the product.

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Ordering information

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Revision history

Table 14. Order codes

Part number

Description

STV7622/BMP

Tested and usawn bump wafer (u = die)

Table 15.

Document revision history

Date

Revision

Changes

29-May-2007

1

Initial release