AD8488

Data Sheet

Rev. A | Page 18 of 20

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MS-034-AAF-1

WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.

1.00

BSC

1.00

REF

A

B

C

D

E

F

G

9

10

8

11

12

13

14

7

5

6

4

2

3

1

BOTTOM VIEW

15.00

BSC SQ

H

J

K

L

M

N

P

0.40 MIN

DETAIL A

TOP VIEW

DETAIL A

COPLANARITY

0.20

0.70

0.60

0.50

BALL DIAMETER

SEATING

PLANE

17.20

17.00 SQ

16.80

A1 BALL

CORNER

A1 BALL

CORNER

*2.20

2.00

1.80

*1.60

1.50

1.40

15

16

R

T

Figure 20. 255-Ball Chip-Scale Package Ball Grid Array [CSP_BGA]

(BC-255-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8488KBCZ

0°C to +85°C

255-Ball CSP_BGA

BC-255-1

1

Z = RoHS Compliant Part.