| 전자부품 데이터시트 검색엔진 |
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ALMD-LB36-RU002 데이터시트(PDF) 7 Page - Broadcom Corporation. |
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ALMD-LB36-RU002 데이터시트(HTML) 7 Page - Broadcom Corporation. |
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7 / 11 page ![]() 7 Figure 14. Recommended Soldering Land Pattern Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum and above 5.2 2.1 Figure 15. Recommended Pick and Place Nozzle Tip (Urethane PAD Tip) Figure 16. Recommended Leaded Reflow Soldering Profile Figure 17. Recommended Pb- Free Reflow Soldering Profile Note: For detail information on reflow soldering of Avago Surface Mount LED, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 240°C MAX. 20 SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. TIME 183°C 100-150°C -6°C/SEC. MAX. 60-150 SEC. 3°C/SEC. MAX. 217°C 200°C 60 - 120 SEC. 6°C/SEC. MAX. 3 °C/SEC. MAX. 3°C/SEC. MAX. 150°C 255 - 260 °C 100 SEC. MAX. 10 to 30 SEC. TIME 4.00 5.00 Pick & Place Nozzle Nozzle Depth Note: 1. Nozzle depth should be touching LED flange during pick and place. 2. Nozzle width should be able to fit into LED carrier tape LED Flange |
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