ATMEGA3208 datasheet(11/68 Pages) MICROCHIP

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where PD is the total power dissipation.

The total thermal resistance of a package (RθJA) can be separated into two components, RθJC and RθCA,

representing the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)

and from the case to the outside ambient air (RθCA). These terms are related by the equation:

RθJA = RθJC + RθCA.

RθJC is device related and cannot be influenced by the user. However, RθCA is user dependent and can

be minimized by thermal management techniques such as heat sinks, ambient air cooling, and thermal

convection. Thus, good thermal management on the part of the user can significantly reduce RθCA so that

RθJA approximately equals RθJC.

The power dissipation curve is negatively sloped as ambient temperature increase. The maximum power

dissipation is therefore at minimum ambient temperature while the highest junction temperature occurs at

the maximum ambient temperature.

Table 5-4. Power Dissipation and Junction Temperature vs Temperature

Package

TA Range

RθJA (°C/W)

PD (W) typical

TJ - TA(°C) typical

VQFN32

-40°C to 125°C

1.0

TQFP32

-40°C to 125°C

1.0

5.4

Power Consumption

The values are measured power consumption under the following conditions, except where noted:

•

VDD=3V

•

TA=25°C

•

OSC20M used as system clock source, except where otherwise specified

•

System power consumption measured with peripherals disabled and without I/O drive.

Table 5-5. Power Consumption in Active and Idle Mode

Mode Description

Condition

Typ. Max. Unit

Active Active power consumption

fCLK_CPU=20 MHz (OSC20M)

VDD=5V 8.5

fCLK_CPU=10 MHz (OSC20M div2)

VDD=5V 4.3

VDD=3V 2.3

fCLK_CPU=5 MHz (OSC20M div4)

VDD=5V 2.15 -

VDD=3V 1.2

VDD=2V 0.75 -

fCLK_CPU=32 KHz (OSCULP32K)

VDD=5V 16.4 -

µA

VDD=3V 9.0

µA

VDD=2V 6.0

µA

Idle

Idle power consumption

fCLK_CPU=20 MHz (OSC20M)

VDD=5V 2.8

fCLK_CPU=10 MHz (OSC20M div2)

VDD=5V 1.4

ATmega3208/4808 – 32-pin Data Sheet

Electrical Characteristics

Datasheet Preliminary

DS40002017A-page 11

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