Data Sheet

ADPL42005

analog.com

Rev. 0

22 of 26

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the

ADPL42005. However, a point of diminishing returns is eventually reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible

to the VOUT and GND pins. Use of 0805 or 0603 size capacitors and resistors achieves the smallest possible footprint

solution on boards where area is limited.

Figure 49. Example LFCSP PCB Layout

Figure 50. Example SOIC PCB Layout