0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

(PADS 6 - 7, OPTIONAL FOR OTHER PADS)

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED FOR PADS 1 - 5 & 8 - 12)

(0.05) TYP

2X

(1.13)

6X

(1.32)

2X (0.31)

2X

(2.85)

(3.3)

20X (0.5)

(4.7)

22X (0.25)

10X (0.7)

(5.4)

(R0.05) TYP

(

0.2) VIA

TYP

6X (1.4)

2X (0.7)

SYMM

1

6

7

12

SYMM

LAND PATTERN EXAMPLE

13

METAL UNDER

SOLDER MASK

2X

SOLDER MASK

OPENING

2X

5

8

5

CSD96497Q5MC

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SLPS714A – JANUARY 2019 – REVISED MARCH 2019

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Copyright © 2019, Texas Instruments Incorporated

6.2 Recommended PCB Land Pattern

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON

PCB Attachment (SLUA271).

4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to

their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.