Ultra-Low-Power, I2C Isolator with

Unidirectional SCL, Extended VDD,

Idle-Bus Hot-Swap, and Low VOL

ADuM1253

19-101761; Rev 1; 5/24

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Absolute Maximum Ratings

VDD1 to GND1.................................................... -0.3V to +6.0V

VDD2 to GND2 ................................................... -0.3V to +6.0V

SDA1, SCL1 to GND1........................................ -0.3V to +6.0V

SDA2, SCL2 to GND2........................................ -0.3V to +6.0V

Short-Circuit Continuous Current

__SDA1, SCL1 to VDD1................................................... 20mA

__SDA2, SCL2 to VDD2................................................. 100mA

Continuous Power Dissipation

__8 MSOP (Derate 3.09mW/°C above +70°C) .......... +247mW

__8 NSOIC (Derate 5.49mW/°C above +70°C) ......... +440mW

__8 WSOIC (Derate 5.88mW/°C above +70°C)......... +471mW

Temperature

__Operating Temperature Range................... -40°C to +125°C

__Junction Temperature................................................+150°C

__Storage Temperature ................................. -65°C to +150°C

__Lead Temperature (Soldering, 10s) ..........................+300°C

__Soldering Temperature (reflow).................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

8 MSOP

Outline Number

21-0036

Land Pattern Number

90-0092

Junction-to-Ambient Thermal Resistance (θJA)

324°C/W

Junction-to-Case Top Thermal Resistance (θJC(TOP))

72°C/W

Junction-to-Board Thermal Resistance (θJB)

153.5°C/W

Junction-to-Case Top Thermal Characterization Parameter (ψJT)

4°C/W

Junction-to-Board Thermal Characterization Parameter (ψJB)

152°C/W

Moisture Sensitivity Level

3

8 Narrow SOIC

Outline Number

21-0041

Land Pattern Number

90-0096

Junction-to-Ambient Thermal Resistance (θJA)

182°C/W

Junction-to-Case Top Thermal Resistance (θJC(TOP))

50°C/W

Junction-to-Board Thermal Resistance (θJB)

63.6°C/W

Junction-to-Case Top Thermal Characterization Parameter (ψJT)

8°C/W

Junction-to-Board Thermal Characterization Parameter (ψJB)

60°C/W

Moisture Sensitivity Level

3