STPS340_07 datasheet(5/11 Pages) STMICROELECTRONICS

5 / 11 page

STPS340

Characteristics

5/11

Figure 13.

Relative variation of thermal

impedance junction to lead

versus pulse duration - SMB flat

Figure 14.

Reverse leakage current versus

reverse voltage applied (typical

values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Z/R

th(j-l)

SMB flat

t (s)

Single pulse

I (mA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

j=150°C

j=125°C

j=100°C

j=75°C

j=25°C

V (V)

Figure 15.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 16.

Forward voltage drop versus

forward current

Figure 17.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, eCU = 35 µm) (DPAK)

Figure 18.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, eCU = 35 µm)

(SMB / SMC)

100

1000

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

(A)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

j=25°C

(Maximum values)

j=125°C

(Typical values)

j=125°C

(Typical values)

j=125°C

(Maximum values)

(V)

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(cm²)

DPAK

(°C/W)

th(j-a)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB / SMC

(cm²)

(°C/W)

th(j-a)

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